Plastic and nonmetallic article shaping or treating: processes – Direct application of fluid pressure differential to... – Producing multilayer work or article
Patent
1998-06-26
2000-10-03
Ortiz, Angela
Plastic and nonmetallic article shaping or treating: processes
Direct application of fluid pressure differential to...
Producing multilayer work or article
26427217, 264276, B29C 3318, B29C 7070
Patent
active
061268852
ABSTRACT:
According to the present invention, a method for manufacturing a resin-molded semiconductor device by interposing a sealing sheet within a molding die for encapsulating a lead frame, on which a semiconductor chip has been bonded, with a molding compound, is provided. In adhering the sealing sheet to the lead frame and encapsulating the lead frame with the molding compound, tension is applied to the sealing sheet.
REFERENCES:
patent: 4975765 (1990-12-01), Ackermann et al.
patent: 4994224 (1991-02-01), Itoh et al.
patent: 5000903 (1991-03-01), Matzinger et al.
patent: 5218759 (1993-06-01), Juskey et al.
patent: 5674343 (1997-10-01), Hotta et al.
patent: 5824252 (1998-10-01), Miyajima
patent: 5846477 (1998-12-01), Hotta et al.
Morikawa Takeshi
Oida Seishi
Suematsu Nobuhiro
Yamada Yuichiro
Yamaguchi Yukio
Matsushita Electronics Corporation
Ortiz Angela
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