4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Insulating material

Seiji Andoh

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Method for packaging semiconductor device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Method of manufacturing semiconductor device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate

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Package structure for a semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Package structure for a semiconductor device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
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Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
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Profile ID: LFUS-PAI-P-2593097

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