Semiconductor device

Details Semiconductor device Semiconductor device

2007-04-24

2007-04-24

Menz, Douglas (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S678000, C257S777000

Reexamination Certificate

active

10766938

ABSTRACT:
A semiconductor device including a substrate having a main surface including a first area, a second area surrounding the first area, and a third area surrounding the second area; a first insulating protective film that is provided in the first area and formed in a shape having no angles; a second insulating protective film provided in the third area; a semiconductor chip that is provided on the first insulating protective film and has a bottom surface facing to the first insulating protective film; and a sealing resin covering the semiconductor chip, wherein the bottom surface of the semiconductor chip covers the first area.

REFERENCES:
patent: 6552421 (2003-04-01), Kishimoto et al.
patent: 11-163201 (1999-08-01), None
patent: 2000-133742 (2000-05-01), None
patent: 2001-217261 (2001-08-01), None
patent: 2002-057245 (2002-02-01), None
Notice of Reason for Rejection dated Oct. 25, 2005.
Official Notice of Reason for Rejection dated Aug. 1, 2006.

Affiliated with

Also associated with

Rating

Semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3724050