Package structure for a semiconductor device

Details Package structure for a semiconductor device Package structure for a semiconductor device

2006-10-17

2006-10-17

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S719000, C361S760000, C257S707000, C165S080300, C174S016300

Reexamination Certificate

active

07123480

ABSTRACT:
A package structure for a semiconductor device comprises a substrate having a main surface and a back surface, a semiconductor chip formed on the main surface of the substrate, a package covering the semiconductor chip, radiation protrude electrodes and connection protrude electrodes. The radiation protrude electrodes are formed on the back surface of the substrate in a chip area where said semiconductor chip is located. Each of the radiation protrude electrodes are formed with a first pitch so that the radiation protrude electrodes make one body joining layer when the package structure is subjected to a heat treatment. The connection protrude electrodes are formed on the back surface of the substrate in a peripheral area of the chip area. Each of the connection protrude electrodes formed with a second pitch which is larger than the first pitch so that the connection protrude electrodes stay individual when the package structure is subjected to a heat treatment.

REFERENCES:
patent: 4460537 (1984-07-01), Heinle
patent: 4924352 (1990-05-01), Septfons
patent: 5011066 (1991-04-01), Thompson
patent: 5132778 (1992-07-01), Juskey et al.
patent: 5136366 (1992-08-01), Worp et al.
patent: 5153385 (1992-10-01), Juskey et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5490324 (1996-02-01), Newman
patent: 5506756 (1996-04-01), Haley
patent: 5592025 (1997-01-01), Clark et al.
patent: 5616888 (1997-04-01), McLaughlin et al.
patent: 5640047 (1997-06-01), Nakashima
patent: 5640048 (1997-06-01), Selna
patent: 5642261 (1997-06-01), Bond et al.
patent: 5708566 (1998-01-01), Hanninghaus et al.
patent: 5729432 (1998-03-01), Shim et al.
patent: 5729894 (1998-03-01), Rostoker et al.
patent: 5767575 (1998-06-01), Lan
patent: 5864470 (1999-01-01), Shim et al.
patent: 5894410 (1999-04-01), Barrow
patent: 5909058 (1999-06-01), Yano et al.
patent: 6037656 (2000-03-01), Sugahara
patent: 6046499 (2000-04-01), Yano et al.
patent: 6057596 (2000-05-01), Lin et al.
patent: 6084295 (2000-07-01), Horiuchi et al.
patent: 6194782 (2001-02-01), Katchmar
patent: 6225702 (2001-05-01), Nakamura
patent: 6268568 (2001-07-01), Kim
patent: 6282094 (2001-08-01), Lo et al.
patent: 6294407 (2001-09-01), Jacobs
patent: 6359341 (2002-03-01), Huang et al.
patent: 08-70062 (1996-03-01), None
patent: A-08-097322 (1996-04-01), None
patent: 409321188 (1997-12-01), None

Affiliated with

Also associated with

Rating

Package structure for a semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Package structure for a semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package structure for a semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3675916