Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-08-16
2005-08-16
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S614000
Reexamination Certificate
active
06929979
ABSTRACT:
A resin sealed type semiconductor device; is provided with a semiconductor chip which has a pad formed on a main surface thereof, an insulating film which is formed on a part of the pad and on the main surface of the semiconductor chip, an interconnection which is formed on a part of the insulating film and which is electrically connected to the pad, a sealing resin which seals the interconnection and the insulating film, a post formed on the interconnection which has a surface exposed to outside of the sealing resin and which is electrically connected to the interconnection, a bump electrode which is mounted on the exposed surface of the post and a radiation post which is formed on the insulating film and which has a surface exposed to outside of the sealing resin.
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Fourson George
Oki Electric Industry Co. Ltd.
Rabin & Berdo PC
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