4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Responsive to non-electrical signal

Scott Estes

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Circuit board-mounted IC package cooling and method

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Patent

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Circuit board-mounted IC package cooling apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal
Patent

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Circuit board-mounted IC package cooling apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Method and apparatus for reworking ball grid array packages to a

Metal fusion bonding – Process – Repairing – restoring – or renewing product for reuse
Patent

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Profile ID: LFUS-PAI-P-886405

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