Metal fusion bonding – Process – Repairing – restoring – or renewing product for reuse
Patent
1993-12-29
1995-02-28
Heinrich, Samuel M.
Metal fusion bonding
Process
Repairing, restoring, or renewing product for reuse
228264, 228 19, 228 41, 427123, 4273837, H01L 2160
Patent
active
053929802
ABSTRACT:
A rework process for ball grid array (BGA) packages which allows for reuse of devices that have been removed for lack of integrity of solder interconnections. The process uses a rework tool which comprises a plate including one or more depressions corresponding to the contours of inverted BGA packages. A BGA package to be reworked is placed in a respective depression with what remains of the original solder ball grid facing upward. The residual solder balls are wicked away, thus leaving the BGA package with the pads that the solder balls were attached to being exposed. A stencil with BGA patterns punched into it is then placed over the rework tool and solder paste is screened onto the rework tool so that the solder is deposited on the BGA pads via the openings in the stencil. The entire fixture is then subjected to a reflow process to cause the solder to ball up during this process. After the reflow process has completed, the stencil is removed, leaving behind a ball grid array similar to that found in the original package.
REFERENCES:
patent: 4923521 (1990-05-01), Liu et al.
patent: 5100045 (1992-03-01), Wiand
patent: 5129573 (1992-07-01), Duffey
patent: 5172853 (1992-12-01), Maiwald
Bell James
Estes Scott
Swamy Deepak N.
Dell USA L.P.
Heinrich Samuel M.
Hood Jeffrey L.
Huffman James W.
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