4. Seal for a joint or juncture
  5. Seal between relatively movable parts
  6. Piston ring or piston ring expander or seat therefor

Satoshi Horie

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Bare chip mounting method and bare chip mounting system

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Bonding method and apparatus

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
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Bump bonding method apparatus

Metal fusion bonding – Process – Plural joints
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Electronic part mounting apparatus and method

Metal working – Plural diverse manufacturing apparatus including means for... – Separate tool stations for selective or successive operation...
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Film substrate treatment apparatus, film substrate treatment...

Semiconductor device manufacturing: process – Radiation or energy treatment modifying properties of...
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Profile ID: LFUS-PAI-P-2301092

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