Electronic part mounting apparatus and method

Metal working – Plural diverse manufacturing apparatus including means for... – Separate tool stations for selective or successive operation...

Reexamination Certificate

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C029S564000, C029S739000, C029S740000, C029S741000

Reexamination Certificate

active

06996889

ABSTRACT:
An electronic part mounting apparatus includes a chamber for cleaning a substrate and an electronic part by plasma, a mounting mechanism for mounting the electronic part on the electronic part, and a conveying robot for conveying the substrate and the electronic part from the chamber to the mounting mechanism. After plasma cleaned, the substrate and the electronic part are swiftly conveyed to the mounting mechanism by the conveying robot. After the electronic part is mounted on the substrate by the mounting mechanism, the resultant combination of them is pulse heated. Therefore, the electronic part is appropriately mounted on the substrate in a state that those are exposed to the air. A part mounting mechanism is simplified.

REFERENCES:
patent: 5564159 (1996-10-01), Treiber
patent: 5609290 (1997-03-01), Bobbio et al.
patent: 6227436 (2001-05-01), Nishikawa et al.
patent: 6245189 (2001-06-01), Rigali et al.
patent: 6392286 (2002-05-01), Jin et al.
patent: 6468833 (2002-10-01), Uner et al.
patent: 6551860 (2003-04-01), Uner et al.
patent: 6727654 (2004-04-01), Ogawa et al.
patent: 3-241755 (1991-10-01), None
“Development of chip-on-chip bonding process at a room temperature (with copper, a bumpless bonding is also possible)”, Semiconductor Sangyo Newspaper, Jun. 12, 2002, p. 9, Sangyo Times Inc., Tokyo, Japan.
“Development of chip-on-chip bonding process at a room temperature by a superbonder”, Electronic Materials, Jul. 1, 2002, pp. 8-9, vol. 41 No. 7, Kogyo Chosakai Publishing Co., Ltd., Tokyo, Japan.
“Ultrasonic Flip Chip Bonding Technology for LSI Chip with High Pin Counts” by Kajiwara et al., from Proceedings of the 7th Symposium on Microjoining and Assembly Technology in Electronics, Feb. 1, 2001, pp. 16166, Japan Welding Society, Tokyo, Japan.

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