4. Stock material or miscellaneous articles
  5. All metal or with adjacent metals
  6. Component of composite having metal continuous phase...

Sarah H. Knickerbocker

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Alignment verification for C4NP solder transfer

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Baseplate for chip burn-in and/of testing, and method thereof

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Enhanced removal of carbon from ceramic substrate laminates

Plastic and nonmetallic article shaping or treating: processes – Including step of generating heat by friction
Patent

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I/C chip suitable for wire bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Large ceramic article and method of manufacturing

Stock material or miscellaneous articles – All metal or with adjacent metals – Having metal particles
Patent

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Profile ID: LFUS-PAI-P-535677

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