Samuel Ho

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Mechanism for high bandwidth DMA transfers in a PCI environment

Electrical computers and digital data processing systems: input/ – Intrasystem connection – Bus access regulation
Patent

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Mechanism for high bandwidth DMA transfers in a PCI environment

Patent

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Multi-die module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Multi-die module and method thereof

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Optical subassembly for optoelectronic devices

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1025483

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