Multi-die module

Details Multi-die module Multi-die module

2007-05-08

2007-05-08

Parker, Kenneth (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S723000, C257S787000, C257S706000, C257S685000, C257SE25023, C438S106000, C438S107000, C361S767000

Reexamination Certificate

active

09886741

ABSTRACT:
A multi-die module is electrically connected to both an unpackaged die and a packaged die as disclosed herein. The multi-die module has a footprint that is the same as conventional multi-die packages, which do not include packaged die, thereby allowing the multi-die module to be interchangeable with conventional multi-die packages. In one embodiment, the unpackaged die is a graphics processor, and the packaged die is a standard memory that has been burned in, functionally tested, and speed rated.

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