4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With structure for mounting semiconductor chip to lead frame

Ryuji Hosokawa

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Method of fabricating a semiconductor device package having...

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate

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Method of fabricating a semiconductor device package having...

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate

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Method of manufacturing resin-sealed semiconductor device, lead

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Process of folding a strip leadframe to superpose two leadframes

Fishing – trapping – and vermin destroying
Patent

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Semiconductor device and a method of assembling a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1891102

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