Semiconductor device and a method of assembling a...

Details Semiconductor device and a method of assembling a... Semiconductor device and a method of assembling a...

2007-11-20

2007-11-20

Fourson, George (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S698000, C257S777000, C257SE23011, C257SE23067, C257SE23174

Reexamination Certificate

active

11216144

ABSTRACT:
A semiconductor device includes a substrate having first and second surfaces, the substrate having an opening; a first adhesive layer provided on the first surface; a second adhesive layer provided under the second surface; a third adhesive layer provided around the opening; a semiconductor chip arranging a plurality of chip bonding pads in a central portion of the semiconductor chip and adhered on the third adhesive layer; substrate bonding pads adhered under the second adhesive layer; bonding wires connecting the chip bonding pads to the substrate bonding pads; and an encapsulating resin provided around the semiconductor chip.

REFERENCES:
patent: 6747361 (2004-06-01), Ichinose
patent: 2002/0089050 (2002-07-01), Michii et al.
patent: 2002/0171145 (2002-11-01), Higuchi et al.
patent: 2004/0207056 (2004-10-01), Seki et al.
patent: 2005/0017342 (2005-01-01), Morrison
patent: 2005/0073035 (2005-04-01), Moxham

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