Process of folding a strip leadframe to superpose two leadframes

Details Process of folding a strip leadframe to superpose two leadframes Process of folding a strip leadframe to superpose two leadframes

1995-05-04

1997-03-25

Niebling, John

Fishing, trapping, and vermin destroying

437217, 437220, H01L 2148, H01L 2156, H01L 2158, H01L 2170

Patent

active

056144415

ABSTRACT:
A method of manufacturing a semiconductor device wherein, a first lead frame portion has a bed portion for mounting a semiconductor element and a plurality of inner and outer leads. A second lead frame portion has a bed portion for mounting a semiconductor element and a plurality of inner and outer leads as in the first lead frame portion coupled to the second lead frame portion through a coupling portion. The first and second lead frame portions are folded at the coupling portion and superposed such that the two semiconductor elements oppose each other. At this time, the plurality of inner and outer leads of the first and second lead frames are alternately and adjacently arranged. Each electrode of the semiconductor elements is connected to a corresponding inner lead. The superposed first and second lead frames are sealed with a mold resin while leaving end portions of the plurality of outer leads of the first and second lead frames.

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patent: 5126823 (1992-06-01), Otsuka et al.
patent: 5147815 (1992-09-01), Casto
patent: 5299092 (1994-03-01), Yaguchi et al.

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