Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent
1994-03-16
1996-08-06
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
257666, 257723, H01L 23495, H01L 2334
Patent
active
055436587
ABSTRACT:
According to a method of manufacturing a semiconductor device of this invention, a first lead frame portion has a bed portion for mounting a semiconductor element and a plurality of inner and outer leads. A second lead frame portion has a bed portion for mounting a semiconductor element and a plurality of inner and outer leads as in the first lead frame portion coupled to the second lead frame portion through a coupling portion. The first and second lead frame portions are folded at the coupling portion and superposed each other such that the two semiconductor elements oppose each other. At this time, the plurality of inner and outer leads of the first and second lead frames are alternately and adjacently arranged. Each electrode of the semiconductor elements is connected to a corresponding inner lead. The superposed first and second lead frames are sealed with a mold resin while leaving end portions of the plurality of outer leads of the first and second lead frames.
REFERENCES:
patent: 4496965 (1985-07-01), Orcutt et al.
patent: 4984065 (1991-01-01), Sako
patent: 5126823 (1992-06-01), Otsuka et al.
patent: 5299092 (1994-03-01), Yaguchi et al.
European Search Report.
Hosokawa Ryuji
Yanagida Satoru
Clark S. V.
Crane Sara W.
Kabushiki Kaisha Toshiba
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