Method of manufacturing resin-sealed semiconductor device, lead

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257666, 257723, H01L 23495, H01L 2334

Patent

active

055436587

ABSTRACT:
According to a method of manufacturing a semiconductor device of this invention, a first lead frame portion has a bed portion for mounting a semiconductor element and a plurality of inner and outer leads. A second lead frame portion has a bed portion for mounting a semiconductor element and a plurality of inner and outer leads as in the first lead frame portion coupled to the second lead frame portion through a coupling portion. The first and second lead frame portions are folded at the coupling portion and superposed each other such that the two semiconductor elements oppose each other. At this time, the plurality of inner and outer leads of the first and second lead frames are alternately and adjacently arranged. Each electrode of the semiconductor elements is connected to a corresponding inner lead. The superposed first and second lead frames are sealed with a mold resin while leaving end portions of the plurality of outer leads of the first and second lead frames.

REFERENCES:
patent: 4496965 (1985-07-01), Orcutt et al.
patent: 4984065 (1991-01-01), Sako
patent: 5126823 (1992-06-01), Otsuka et al.
patent: 5299092 (1994-03-01), Yaguchi et al.
European Search Report.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing resin-sealed semiconductor device, lead does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing resin-sealed semiconductor device, lead , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing resin-sealed semiconductor device, lead will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2193095

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.