4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Ronald L. Strijek

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Apparatus and method for snap-on thermo-compression bonding

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent

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Apparatus and method for snap-on thermo-compression bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Apparatus for testing semiconductor laser devices

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent

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Fiber/waveguide-mirror-lens alignment device

Optical waveguides – With optical coupler – With alignment device
Patent

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Hermetically sealed external cavity laser system and method

Coherent light generators – Particular resonant cavity
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1346707

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