Apparatus and method for snap-on thermo-compression bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

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Details

C257S710000, C257S711000, C257S698000, C257S699000

Reexamination Certificate

active

06172414

ABSTRACT:

BACKGROUND OF THE INVENTION
The present invention relates generally to device packaging, and more particularly to the device interconnections for mounting semiconductor devices to substrates.
Rapid advances in technology have accelerated the need for device interconnections which can satisfy, among other requirements, a greater number of functions and increased speed without compromising yield or reliability. Conventional device interconnections include ball grid arrays, wire bonding, tape automated bonding, and controlled collapse chip connections, such as flip chip packages. Flip chip packages tend to be particularly popular because they have higher densities, thereby allowing more functions to be incorporated in a single package.
Conventional packaging techniques, including flip chip packages, however, fail to address the specific needs of high frequency semiconductor devices, particularly with respect to providing low loss, reproducible electrical interconnections at the substrate level for mounting semiconductors. Specifically, the attachment material in flip chip packages, typically solder, epoxy or gold, is applied directly to a semiconductor which is then aligned and attached to a substrate. Flip chip packaging techniques which utilize solder-type bump attachments are limited due to non-uniformity of solder bumps, poor wetting quality and reduced reliability caused by the use of fluxes. Additionally, because of the toxic nature of lead, elaborate manufacturing facilities are needed, resulting in high production costs and poor thermal conductivity particularly with respect to lead/tin based solder.
Flip chip packages which utilize epoxy-type bump attachments suffer from problems as well, including non-uniformity of epoxy bumps, a need for special application equipment, epoxy outgassing, bleed out contamination, poor thermal conductivity and restrictions in applying opto-electronic devices. Similarly, some of the problems associated with flip chip packages utilizing gold-type bumps include non-uniformity of gold bumps, poor thermal conductivity and size restrictions, with each ball typically having a minimum diameter of 125 microns.
What is needed therefore is a low loss, economical device interconnection for connecting semiconductors to substrates which would provide high bandwidth connections and provide improvements in yield and reliability.
SUMMARY OF THE INVENTION
The preceding and other shortcomings of the prior art are addressed and overcome by the present invention which provides, in a first aspect, a connected electrical apparatus, including a rod attached to a semiconductor device and having a body extending outwardly therefrom, with the rod having a base which extends radially outwardly therefrom, and a rod receptor attached to a substrate. The rod receptor is formed of a housing defining a well for receiving the rod, and includes a lip portion formed at one end of the rod receptor. The semiconductor device and substrate are interconnected by engagement of the rod to the rod receptor with the rod interlockingly engaging with the rod receptor lip portion.
In a further aspect of the invention, a method is provided which includes the steps of forming a rod with a base portion extending outwardly from an end thereof; and fixedly attaching the rod to a semiconductor device, with the rod base portion being disposed proximal to said semiconductor device. A rod receptor is formed of a housing defining a well and having a lip portion, where the receptor is then fixedly attached to a substrate with the housing lip portion being disposed distal from said substrate. The rod and rod receptor are aligned, and the rod is inserted into the rod receptor. The semiconductor device and the substrate are interconnected by engaging the rod with the receptor housing such that said rod spreads out and curls under the housing lip portion.
The foregoing and additional features and advantages of this invention will become apparent from the detailed description and accompanying drawing figures below. In the figures and the written description, numerals indicate the various features of the invention, like numerals referring to like features throughout both the drawing figures and the written description.


REFERENCES:
patent: 5118584 (1992-06-01), Evans et al.
patent: 5214308 (1993-05-01), Nishiguchi et al.
patent: 5457879 (1995-10-01), Gurtler et al.
patent: 5525065 (1996-06-01), Sobhani
patent: 5558271 (1996-09-01), Rostoker et al.
patent: 5643831 (1997-07-01), Ochiai et al.

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