Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent
1998-07-13
2000-11-21
Hardy, David
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
438106, 438108, 438121, 438122, 257775, 257777, 257780, 257782, 29840, 29895, H01L 2144
Patent
active
061501921
ABSTRACT:
An interconnected apparatus for producing a low loss, reproducible electrical interconnection between a semiconductor device and a substrate includes a rod and rod receptor. The rod, generally cylindrically shaped, is attached to the semiconductor device and includes an outer circumferential wall which comes into contact with the rod receptor during a bonding process. A lip portion is formed on one end of the rod receptor for interlocking engagement with the rod. The rod receptor is plated on the substrate and includes a generally circularly shaped body which forms a centrally disposed well for receiving the rod. A lip portion is formed on one end or mouth of the rod receptor for interlocking engagement with the rod. When the rod and corresponding receptor are aligned and brought together, the rod deforms and interlocks with its corresponding rod receptor. A thermo-compression bonding process is utilized to bond the rod to the rod receptor, thereby producing a strong interlocking bond.
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Anderson Eric R.
Rezek Edward A.
Strijek Ronald L.
Tran Dean
Diaz José R.
Hardy David
TRW Inc.
Yatsko Michael S.
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