4. Adhesive bonding and miscellaneous chemical manufacture
  5. Delaminating processes adapted for specified product
  6. Delaminating in preparation for post processing recycling step

Ronald D. Goldblatt

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active

Common ball-limiting metallurgy for I/O sites

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Copper seed layer repair technique using electroless touch-up

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating predominantly semiconductor substrate
Reexamination Certificate

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Lamination method for coating the sidewall or filling a cavity i

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent

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Means of seeding and metallizing polymide

Coating processes – With pretreatment of the base – Preapplied reactant or reaction promoter or hardener
Patent

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Method for enhancing the adhesion of polymer surfaces by water v

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Profile ID: LFUS-PAI-P-84131

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