Means of seeding and metallizing polymide

Details Means of seeding and metallizing polymide Means of seeding and metallizing polymide

1990-10-30

1993-01-12

Beck, Shrive

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

427304, 427305, C23C 2600

Patent

active

051789140

ABSTRACT:
A method for seeding the surface of a polyimide film which has been generated from a precursor polyamic acid film comprising the steps of: generating a film of polyamic acid on a substance (which may be done by conventional spin coating or by other solution coating techniques well known in the art); then either exposing the polyamic acid film to a solution containing palladium cations; heat-treating the palladium-treated film in a time/temperature schedule that causes imidization of the polymer to occur; exposing the seeded film to an electroless plating bath which causes the deposition of blanket metal film on the surface of the polymer film; or curing the film to the polyimide form; mechanically abrading the film surface, exposing the film to a solution containing palladium cations; exposing the seeded film to an electroless plating bath which causes the deposition of blanket metal film on the surface of the polymer film.

REFERENCES:
patent: 3928663 (1975-12-01), Redmond
patent: 4096043 (1978-06-01), De Angelo
patent: 4261800 (1981-04-01), Beckenbaugh
patent: 4654223 (1987-03-01), Araps
patent: 4666742 (1987-05-01), Takakura
patent: 4775449 (1988-10-01), Dumas
patent: 4832799 (1989-05-01), Knudsen
patent: 4931310 (1990-06-01), Anschel
Kirk-Othmer "Encyclopedia of Chemical Technology" J. Wiley & Sons 3rd ed. vol. 18, 1982, pp. 706, 707, 711, 716.

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