Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
Inventor
active
Integrated circuit package system with bump pad
Method for forming a flip chip semiconductor package
Method for forming a wafer level chip scale package, and...
Method for solder bumping, and solder-bumping structures...
Semiconductor package with selective underfill and...
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Profile ID: LFUS-PAI-P-2196220