Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2004-12-09
2008-08-12
Nguyen, Cuong Q (Department: 2811)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S637000, C438S640000
Reexamination Certificate
active
07410824
ABSTRACT:
A method for solder bumping provides a substrate and forms a film on the substrate. The film has openings therethrough. A stencil is aligned on the film. The stencil has openings therethrough over the openings through the film. Solder paste is printed onto the substrate and into the openings through the stencil and the openings through the film. The solder paste is reflowed to form solder balls therefrom. The stencil and the film are then removed.
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patent: 2002/0173134 (2002-11-01), Viswanadam et al.
Alvarez Romeo Emmanuel P.
Do Byung Tai
Lin Yaojian
Ishimaru Mikio
Nguyen Cuong Q
Stats Chippac Ltd.
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