Integrated circuit package system with bump pad

Details Integrated circuit package system with bump pad Integrated circuit package system with bump pad

2011-08-30

2011-08-30

Nguyen, Cuong Q (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S737000, C257S681000, C257SE23010, C257SE23021, C257S774000

Reexamination Certificate

active

08008770

ABSTRACT:
An integrated circuit package system includes an integrated circuit, and forming a patterned redistribution pad over the integrated circuit.

REFERENCES:
patent: 5554940 (1996-09-01), Hubacher
patent: 6717263 (2004-04-01), Sawai et al.
patent: 6756671 (2004-06-01), Lee et al.
patent: 6939789 (2005-09-01), Huang et al.
patent: 2003/0214036 (2003-11-01), Sarihan et al.
patent: 2004/0034489 (2004-02-01), Ogino et al.
patent: 2005/0017355 (2005-01-01), Chou et al.
patent: 2006/0073693 (2006-04-01), Huang
patent: 2006/0214293 (2006-09-01), Park et al.

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