4. Computer-aided design and analysis of circuits and semiconductor
  5. Design of semiconductor mask or reticle
  6. Manufacturing optimizations

Roger A. Quon

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Barrier for interconnect and method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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BLM structure for application to copper pad

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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I/C chip suitable for wire bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Low stress conductive polymer bump

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Low stress conductive polymer bump

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2263209

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