4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Wire contact, lead, or bond

Robert M. Nickerson

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Integrated circuit device mounting with folded substrate and...

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Integrated circuit interconnect

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Power distribution within a folded flex package method and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2733353

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