Integrated circuit device mounting with folded substrate and...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S831000, C029S840000, C029S841000, C174S261000, C257S686000

Reexamination Certificate

active

07818878

ABSTRACT:
In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed.

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