Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-03-04
2010-10-26
Nguyen, Donghai D. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S831000, C029S840000, C029S841000, C174S261000, C257S686000
Reexamination Certificate
active
07818878
ABSTRACT:
In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed.
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Conner John C.
Nickerson Robert M.
Spreitzer Ronald L.
Taggart Brian
INTEL Corporation
Konrad Raynes & Victor LLP
Nguyen Donghai D.
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