Integrated circuit interconnect

Details Integrated circuit interconnect Integrated circuit interconnect

2003-09-05

2004-09-21

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257S786000, C438S617000, C438S612000

Reexamination Certificate

active

06794760

ABSTRACT:

BACKGROUND
An integrated circuit (IC) package is used to electrically couple an IC die to external components and circuitry. An IC package also serves to protect an IC die and to provide a suitable operating environment thereto. These functions may include temperature regulation, impedance matching, and optimization of I/O and power delivery paths. The design of IC package elements may therefore affect the efficiency and/or speed at which an IC die can operate.


REFERENCES:
patent: 5459284 (1995-10-01), Bockelman et al.
patent: 5471010 (1995-11-01), Bockelman et al.

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