4. Electricity: conductors and insulators
  5. Boxes and housings
  6. Hermetic sealed envelope type

Robert G. Winkle

Attorney

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Attorney

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Backside metallization on sides of microelectronic dice for...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Card actuator

Electrical connectors – With coupling separator – Including retainer or joiner
Reexamination Certificate

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Ceramic embedded wireless antenna

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Component retention socket

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit
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Direct BGA attachment without solder reflow

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – By pressure alone
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Profile ID: LFUS-PAI-P-2074972

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