4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

Rieka Ohuchi

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Flip-chip semiconductor device utilizing an elongated tip bump

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Flip-chip semiconductor device utilizing an elongated tip bump

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Resin film and a method for connecting electronic parts by...

Metal fusion bonding – Process – Using a compliant cushioning medium
Reexamination Certificate

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Resin film and a method for connecting electronic parts by...

Stock material or miscellaneous articles – Structurally defined web or sheet – Including components having same physical characteristic in...
Reexamination Certificate

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Semiconductor apparatus and a semiconductor device mounting...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2079724

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