Flip-chip semiconductor device utilizing an elongated tip bump

Details Flip-chip semiconductor device utilizing an elongated tip bump Flip-chip semiconductor device utilizing an elongated tip bump

2005-08-22

2009-08-25

Nhu, David (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S108000, C257SE21007, C257SE21324, C257SE21329, C257SE21499, C257SE21511

Reexamination Certificate

active

07579211

ABSTRACT:
A flip-chip type semiconductor device includes a semiconductor chip having electrode pads formed and arranged on a chip surface thereof. Sprout-shaped metal bumps are bonded to the electrode pads on the chip, and an adhesive resin layer is formed on the chip surface of the chip such that tip ends of the sprout-shaped metal bumps are protruded from the adhesive resin layer. A circumference of the tip end of each sprout-shaped metal bump is surrounded by a protective resin material integrally swelled from the adhesive rein layer such that a tip end face of each sprout-shaped metal bump is at least exposed to the outside.

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