Richard W. Noth

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Compliant lead for surface mounting a chip package to a substrat

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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High performance versatile thermally enhanced IC chip mounting

Fishing – trapping – and vermin destroying
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Integrated semiconductor chip package

Patent

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Lead frame-chip package with improved configuration

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Method of sealing an electronic module in a cap

Metal working – Method of mechanical manufacture – Assembling or joining
Patent

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Profile ID: LFUS-PAI-P-500038

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