Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1993-06-28
1994-11-22
Donovan, Lincoln
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
257666, 257690, 257696, H01H 902
Patent
active
053671244
ABSTRACT:
A compliant lead for electromechanically surface mounting an integrated circuit chip package to a substrate. The compliant lead extends from the package and includes at least two regions of different lead thickness. In a first region, a standard lead thickness is employed to ensure the applicability of existing package fabrication techniques. A second region, having a reduced thickness, then extends from the first region and is predefined to encompass an area of the lead expected to undergo greatest stress during thermal cycling. Compliancy is further guaranteed by providing a solder dam within the region of reduced thickness to limit wicking of solder when the package is solder mounted to the substrate. Lead frame fabrication is also discussed.
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Hoffman Herman S.
Noth Richard W.
Donovan Lincoln
International Business Machines - Corporation
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