Fishing – trapping – and vermin destroying
Patent
1991-06-06
1992-08-11
Wojciechowicz, Edward J.
Fishing, trapping, and vermin destroying
357 71, 357 72, 357 81, 437207, 437209, 437217, 437219, H01L 2348, H01L 2128
Patent
active
051384302
ABSTRACT:
According to the present invention, an improved chip and leadframe package assembly and method of making the same is provided. The package assembly is comprised of a metal leadframe having a chip bond pedestal centrally located and a plurality of discrete leads surrounding the pedestal. An I/C (integrated circuit) semiconductor chip is mounted on the pedestal, the chip having a plurality of connection or bonding pads disposed around the periphery. An interposer having a layer of dielectric material and discrete metal lines formed thereon is mounted on an apron of the chip bonding pedestal between the location of the chip and the inner discrete leads of the leadframe. Connections are provided between the bonding pads on the chip and the respective lines on the interposer and connections are also provided between the fingers and the respective lines on the leadframe. Additionally, the interposer also preferably includes at least one voltage bus line formed thereon having a portion adjacent at least one edge of the chip for connection of any of the chip bond pads thereto. Further, the pedestal also preferably includes radially extending conducting arms suitable for providing both electrical ground connection and a heat dissipation path.
REFERENCES:
patent: 3967366 (1976-07-01), Birglechner et al.
patent: 4800419 (1989-01-01), Long et al.
patent: 4835120 (1989-05-01), Mallik et al.
patent: 4899207 (1990-02-01), Hallowell et al.
patent: 4903114 (1990-02-01), Aoki et al.
patent: 4916506 (1990-04-01), Gagnon
Gow, 3rd John
Noth Richard W.
Hogg William N.
International Business Machines - Corporation
Thornton Francis J.
Wojciechowicz Edward J.
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