4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Richard J. Wong

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Bond pad having vias usable with antifuse process technology

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate

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Bond pad having vias usable with antifuse process technology

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate

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Charge pumps of antifuse programming circuitry powered from high

Electronic digital logic circuitry – Multifunctional or programmable – Having details of setting or programming of interconnections...
Patent

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Method for forming programmable interconnect structures and prog

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Method of determining an electrical characteristic of an antifus

Electricity: measuring and testing – Impedance – admittance or other quantities representative of... – Lumped type parameters
Patent

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Profile ID: LFUS-PAI-P-60486

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