4. Compositions
  5. Electrically conductive or emissive compositions
  6. Free metal containing

Renuka S. Divakaruni

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Ceramic via composition, multilayer ceramic circuit containing s

Compositions – Electrically conductive or emissive compositions – Free metal containing
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Ceramic via composition, multilayer ceramic circuit containing s

Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Metal and nonmetal in final product
Patent

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Low dielectric composite substrate

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent

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Method of bonding inorganic particulate material

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent

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Method of making multilayered ceramic structures having an inter

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
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Profile ID: LFUS-PAI-P-389271

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