Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1986-05-01
1989-12-05
Derrington, James
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
264 61, 264 63, B32B 3124, C04B 3332
Patent
active
048850381
ABSTRACT:
The present invention provides a method for producing multilayered ceramic structures having copper-based conductors therein, wherein the onset of sintering of the copper-based conductor can be adjusted to approach or match that of the ceramic portion of the structure. In addition, methods are provided whereby the polymeric binder resin used in formation of the ceramic portion of the structure can be removed or burned-off, using oxygen-containing ambients, wherein the oxygen content is greater than 200 ppm, without oxidation of the copper-based conductors therein.
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Best et al., Use of Boric Acid Solution with Glass and Copper, IBM Technical Disclosure Bulletin, vol. 15, No. 11 (Apr. 73).
Anderson, Jr. Herbert R.
Casey Jon A.
Divakaruni Renuka S.
Dynys Joseph M.
Kandetzke Steven M.
Blecker Ira D.
Derrington James
Dougherty Anne V.
International Business Machines - Corporation
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