Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
Inventor
active
Apparatus for multilayer conductor chip packaging
Controlled temperature bonding
Diffusion bonding of lead interconnections using precise laser-t
Electronic package with interconnected chips
Electronic packaging shaped beam lead fabrication
No associations
LandOfFree
Raymond Robert Horton does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Raymond Robert Horton, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Raymond Robert Horton will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-126307