4. Metal fusion bonding
  5. Solder form

Raymond A. Jackson

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Apparatus and method for removing interconnections

Metal fusion bonding – Process of disassembling bonded surfaces – per se
Reexamination Certificate

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Baseplate for chip burn-in and/of testing, and method thereof

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
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Ceramic ball grid array using in-situ solder stretch

Metal fusion bonding – Process – Plural joints
Patent

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Conductive adhesive interconnection with insulating polymer...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Electrical interconnection package and method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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Profile ID: LFUS-PAI-P-380127

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