Ravindhar K. Kaw

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Integrated circuit incorporating flip chip and wire bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Integrated circuit with copper interconnect and top level...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – With contact or metallization configuration to reduce...
Reexamination Certificate

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Monolithic semiconductor chip interconnection technique and arra

Patent

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Self-aligning infra-red communication link

Optical communications – Optical communication over freee space – Transmitter and receiver
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1184582

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