Integrated circuit incorporating flip chip and wire bonding

Details Integrated circuit incorporating flip chip and wire bonding Integrated circuit incorporating flip chip and wire bonding

2007-08-28

2007-08-28

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S686000, C257S784000, C257S780000, C257S777000, C257SE23085

Reexamination Certificate

active

10678495

ABSTRACT:
An integrated circuit incorporates flip chip and wire bonding techniques to provide an improved integrated circuit device. The integrated circuit device includes a package having a first plurality of bonding pads and a semiconductor substrate within the integrated circuit package and including a second plurality of bonding pads. A semiconductor substrate has a surface area. A plurality of wire bonds connect the first plurality of bonding pads to the second plurality of bonding pads. The device further includes an interconnection substrate mounted on the semiconductor substrate. The interconnection substrate has a surface area smaller than the semiconductor substrate surface area.

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Office Action from related DE 10 2004 030 541.1-33 in English Translation & German Sep. 1, 2005.

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