Patent
1988-12-27
1991-06-04
Hille, Rolf
357 71, 357 68, H01L 2312, H01L 2508, H01L 2512
Patent
active
050218697
ABSTRACT:
An interconnection arrangement and technique for a single semiconductor chip containing incomplete electric circuitry and having electric surface terminations permitting said incomplete electric circuitry to be externally interconnected, the interconnection arrangement being mountable on the semiconductor chip and capable of electically communicating with the semiconductor chip through electric surface terminations on the top surface of the semiconductor chip and on the bottom surface of the interconnection arrangement.
REFERENCES:
patent: 4021838 (1977-05-01), Warwick
patent: 4074342 (1978-02-01), Honn et al.
patent: 4818728 (1989-04-01), Rai et al.
Clark S. V.
Hewlett--Packard Company
Hille Rolf
Sabath Robert P.
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