Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With heat sink means
Inventor
active
Ball grid array semiconductor package with exposed base layer
Ball-grid array integrated circuit package with an embedded...
Circuit probing contact pad formed on a bond pad in a flip...
Flash-preventing semiconductor package
Flip chip type quad flat non-leaded package
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Profile ID: LFUS-PAI-P-1849260