Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
Inventor
active
Integrated circuit with bonding layer over active circuitry
Method of forming improved thick plated copper interconnect and
Plastic encapsulation for integrated circuits having plated copp
Plastic encapsulation for integrated circuits having plated copp
Thick plated interconnect and associated auxillary interconnect
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Profile ID: LFUS-PAI-P-1114567