4. Stock material or miscellaneous articles
  5. Composite
  6. Of silicon containing

Philipp W. H. Schuessler

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Method for hermetically sealing an electronic circuit package

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
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Passivation of hybrid microelectronic circuits

Stock material or miscellaneous articles – Composite – Of silicon containing
Patent

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Profile ID: LFUS-PAI-P-1432079

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