Method for hermetically sealing an electronic circuit package

Details Method for hermetically sealing an electronic circuit package Method for hermetically sealing an electronic circuit package

1977-11-25

1979-06-26

Goolkasian, John T.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156286, 156292, 156330, 174 1705, 174 52S, 174 5062, 174 52FP, 264 85, 264101, 264516, 357 74, 357 80, B29C 1700

Patent

active

041592212

ABSTRACT:
A hermetically sealed electronic circuit package is formed by placing a preformed, uncured sealant between a circuitized ceramic substrate and a ceramic cover. The resultant assembly is placed in an oven which has been preheated to a temperature at least as great as the curing temperature of the sealant and the oven is then evacuated. Before the sealant reaches its melting temperature, the oven is backfilled with nitrogen and stabilized at atmospheric pressure. The assembly is maintained in the heated environment for a period of time sufficient to substantially cure the sealant. The resulting assembly may be opened to affect any repairs that may become necessary and then reassembled.

REFERENCES:
patent: 2915490 (1959-12-01), Hopper et al.
patent: 3077639 (1963-02-01), Siner et al.
patent: 3336257 (1967-08-01), Alvey
patent: 3341649 (1967-09-01), James
patent: 3383260 (1968-05-01), Mojonnier
patent: 3522121 (1970-07-01), Lorecock et al.
patent: 3711939 (1973-01-01), Stoll
patent: 3749601 (1973-07-01), Tittle
patent: 3943623 (1976-03-01), Mizutani et al.
Schuessler, "Thermal Bonding System", IBM Technical Disclosure Bulletin, vol. 17, No. 7, 12/74 (156/285).

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