4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Of specified material other than unalloyed aluminum

Peter Wrschka

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Carbon-graded layer for improved adhesion of low-k...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Carbon-graded layer for improved adhesion of low-k...

Semiconductor device manufacturing: process – Having organic semiconductive component
Reexamination Certificate

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Chemical mechanical polishing (CMP) process using fixed...

Abrading – Abrading process – Glass or stone abrading
Reexamination Certificate

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Chemical mechanical polishing compositions for copper and...

Abrasive tool making process – material – or composition – With inorganic material
Reexamination Certificate

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Integration scheme for metal gap fill, with fixed abrasive CMP

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Profile ID: LFUS-PAI-P-2583086

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