Chemical mechanical polishing (CMP) process using fixed...

Details Chemical mechanical polishing (CMP) process using fixed... Chemical mechanical polishing (CMP) process using fixed...

2005-05-31

2005-05-31

Nguyen, Dung Van (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S060000

Reexamination Certificate

active

06899597

ABSTRACT:
A semiconductive wafer having a layer of conductive material formed thereon is polished. The semiconductor wafer is rotated against an abrasive polishing pad. A solution is applied to the semiconductor wafer and to the abrasive polishing pad. The solution includes an etchant of the conductive material.

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