Chemical mechanical polishing compositions for copper and...

Abrasive tool making process – material – or composition – With inorganic material

Reexamination Certificate

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C051S309000, C106S003000, C106S005000, C438S692000, C438S693000, C216S105000, C216S106000

Reexamination Certificate

active

07736405

ABSTRACT:
A CMP composition containing a rheology agent, e.g., in combination with oxidizing agent, chelating agent, inhibiting agent, abrasive and solvent. Such CMP composition advantageously increases the materials selectivity in the CMP process and is useful for polishing surfaces of copper elements on semiconductor substrates, without the occurrence of dishing or other adverse planarization deficiencies in the polished copper.

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