Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2006-03-14
2006-03-14
Abraham, Fetsum (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S704000, C257S710000, C438S125000
Reexamination Certificate
active
07012326
ABSTRACT:
A lid having a plurality of recesses at the edges of the lid to provide an improved adhesive bond between the lid and a substrate of an integrated circuit is disclosed. The plurality of recesses may be a castellation comprising a collection of semi-circular cuts into the originally straight edges of the lid. The castellation can be formed by stamping, etching, molding design, or milling/drilling, all of which are well-known methods in the art of forming lids for integrated circuits. The castellation can be vertically straight or it can be slightly tapered, to provide a better locking of the lid on to the package. Epoxy in the recesses can provide an epoxy post for locking the lid. Method of forming a lid having a plurality of recesses and employing a lid on an integrated circuit are also disclosed.
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Chee Soon-Shin
Hsieh Steven H. C.
Wu Paul Ying-Fung
Abraham Fetsum
King John J.
Liu Justin
Xilinx , Inc.
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